STM Article Repository

This paper will discuss how package voids Mold defect was addressed on thinner Compression mold packages like BGA (Ball Grid Array) and Sensor Devices. Significant action was the application of “Rey Resin Dispense” pattern in compression mold granule compound dispensing was a key action in reducing package voids defect. Using a DMAIC methodology (Define, Measure, Analyze, Improve and Control), a powerful analytical tool that serves as a guide towards the success of eliminating package voids defect. Using this methodology, all Key Process Input Variables (KPIVs) of compression mold and its molding compound material were identified as X’s or potential causes and test its significance to affect Y-response which is the package voids. Funneling of X’s further trimmed to the most possible contributor to package voids. The remaining possible contributor X’s undergo statistical validation which point to granule compound resin dispensing as the main contributor to induce package voids defect. Several actions were tried but failed to zero-out the defect. With the help of brainstorming and imaginative ideas and data gathered on how to improve granule resin dispense of compression mold positive outcome was realized. From the concept of light ray, to naming it as “Rey Resin Dispense” significantly reduce package voids defect in all thin BGA and Sensor devices. This learning was then applied to all existing thin packages and to new packages in compression molding process.